NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED
CIN: U45400OR2021PTC035524
Pulls the latest MCA data for this record.
Authorized Capital
₹1 Lakh
Paid-up Capital
₹10K
Company Status
Strike Off
Total Directors
2
Last AGM
—
Balance Sheet
—
NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED having CIN U45400OR2021PTC035524 is a private company incorporated with MCA on 4th February 2021. NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is classified as Non-government company. This company is registered at Registrar of Companies (ROC), ROC Cuttack with an Authorized Share Capital of ₹1,00,000 and paid-up capital of ₹10,000. Current status of NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is Strike Off.
Company Information
| CIN | U45400OR2021PTC035524 |
| Company Status | Strike Off |
| Registration Number | 035524 |
| Date of Incorporation | 4 February 2021 |
| RoC | ROC Cuttack |
| Company Age | 5 years, 3 months, 16 days |
| Authorized Capital | ₹1,00,000 |
| Paid-up Capital | ₹10,000 |
| Company Category | Company limited by shares |
| Company Sub-Category | Non-government company |
| Class of Company | Private |
| Activity | Building completion [ Includes activities that contribute to the completion or finishing of a construction. Repairs of the same type are also included in the corresponding sub-classes] |
| Listing Status | Unlisted |
| Date of Last AGM | — |
| Date of Latest Balance Sheet | — |
Contact Information
Registered Address
Plot No 229/2494, Bhimpur, Unit-VI,BBSR, PS-Capital, Khurda, Khordha, Orissa, India,
751020*****.bjena@gmail.com
Partially masked for privacy
Website
Coming soon
Contact Number
Coming soon
Registered address and email are from MCA records. Website and phone listings will be available here soon.
Directors & Key Managerial Personnel
2 DirectorsData sourced from MCA public records.
2 current records
FAQ's on NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED
Frequently asked questions about this company
NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED having CIN U45400OR2021PTC035524 is a 5 years, 3 months, 16 days old private company incorporated with MCA on 4 February 2021. It is classified as a Non-government company under the class of Private company, registered at ROC Cuttack with an Authorized Share Capital of ₹1 Lakh and Paid-up Capital of ₹10 Thousand.
The Corporate Identification Number (CIN) of NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is U45400OR2021PTC035524.
The registered office address of NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is Plot No 229/2494, Bhimpur, Unit-VI,BBSR, PS-Capital, Khurda, Khordha, Orissa, India — 751020.
As per MCA records, the current status of NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is Strike Off.
NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED has an Authorized Share Capital of ₹1 Lakh and a Paid-up Capital of ₹10 Thousand.
NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is involved in Building completion [ Includes activities that contribute to the completion or finishing of a construction.
NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED has 2 directors: SATYABRATA JENA (DIN: 09023946) and JAGANNATH PANI (DIN: 09053991).